2018 — 2021
Design leadership
Led ten team-scoped programs with durations from six months to two years—shepherding architecture choices, reviews, and customer milestones.
Singapore
Guanqiong Cui
Staff Engineer
Technical leadership across RF front-end design—turning customer requirements into robust chip solutions, production-grade analytics, and teams that ship together.
Leadership
How I work
At the staff level I focus on multiplying others—clarifying technical direction, aligning stakeholders across time zones, and raising the bar on how we design, test, and learn from production data.
Team synergy, striving for excellence, and impact orientation remain the three values I optimise for; they show up in how I run reviews, mentor engineers, and prioritise the next right decision.
Experience
A progressive scope from hands-on development to design leadership and staff-level technical direction.
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Staff Engineer
Qualcomm RF360 · Singapore
2024 — Present
- Set technical direction for complex RF front-end initiatives while coordinating priorities with international partners.
- Grow engineers through structured design reviews, coaching, and ownership of critical path workstreams.
- Align cross-functional teams on architecture, evaluation plans, and timelines—keeping customer commitments and quality in balance.
- Institutionalise analytics and design practices so lessons from production inform the next generation of designs.
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Senior Product Development Engineer & Design Lead
Qualcomm RF360 · Singapore
2018 — 2024
- Earned the highest performance rating band (top ~5%) for sustained impact on delivery and design quality.
- Delivered tailored RF design solutions from customer requirements through qualification, balancing performance, cost, and manufacturability.
- Drove systematic computational analysis of production data to refine designs and diagnose process deviations against intent.
- Partnered with cross-functional teams across five countries on development, bring-up, and technical risk closure.
- Proposed materials, design technologies, and test strategies—and provided hands-on guidance across concurrent programs.
- Led groups of around five engineers on multiple chip design projects running in parallel.
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Product Development Engineer II
Qualcomm RF360 · Singapore
2016 — 2018
- Deepened ownership of module design, validation, and customer-facing technical engagement.
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Product Development Engineer I
Qualcomm RF360 · Singapore
2014 — 2016
- Built foundational skills in product development, lab bring-up, and collaborative execution within a global engineering organisation.
Selected work
Impact highlights
Moments that illustrate breadth—from program leadership to IP and global collaboration.
2018 — 2021
Technology transfer
Selected to manage and lead international collaboration for technology transfers—bridging process, design intent, and execution across sites.
2021
Patent
Multiband multiplexer for carrier aggregation—translating architecture innovation into protected IP.
Capabilities
Skills
Technical depth paired with the leadership toolkit needed at staff level.
Technical
- RF / front-end module design
- Design-for-manufacturing & cost trade-offs
- Computational analysis & production diagnostics
- Test strategy & validation planning
- Materials & process technology assessment
Leadership
- Cross-functional program alignment
- Mentoring & technical reviews
- Stakeholder & customer communication
- Roadmap and critical-path management
- International team coordination
Academic
Education & languages
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Nanyang Technological University
2013 — 2014
Singapore
MSc, Communication Engineering (EEE)
Shanghai Ranking — communication field ranked 5th globally at the time of the program.
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Beijing University of Posts and Telecommunications
2009 — 2013
Beijing, China
BSc, Information Engineering / Information and Communication Engineering
Shanghai Ranking — telecommunications field ranked 5th globally at the time of the program.
Languages
- Fluent in English
- Native in Chinese
- Beginner in Korean